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End of support for 3DMark 11 and other benchmarks announced

UL Benchmarks has announced that they will no longer support some of their 3DMark benchmarks noting that these legacy benchmark tools “no longer provide meaningful results on modern hardware” Just as  Microsoft will end support for Windows 7 on January 14, 2020, these Benchmarks are at their end of life that when used with new modern […]

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Hitachi Vantara Redefines Enterprise Storage With AI-Driven Data Center Operations Solutions

Hitachi Vantara, a wholly owned subsidiary of Hitachi, Ltd. (TSE: 6501), announced a powerful next-generation storage and infrastructure foundation with a new scale-out, scale-up architecture for any workload at any scale. The solution includes Hitachi Virtual Storage Platform (VSP) 5000 series, the company’s latest and the world’s fastest1 enterprise-class storage array, along with the new […]

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MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs

MediaTek is partnering with Intel to bring MediaTek’s new 5G modem to PCs. Through this partnership, Intel has been working with MediaTek on the 5G solution for deployment in key consumer and commercial laptop segments. MediaTek is developing the 5G modem and working with partners to manufacture the solution. Dell and HP are expected to […]

Enterprise Tech

QNAP QGD-1600P – World’s First Smart PoE Edge Switch with QTS and Virtualization

The QNAP QGD-1600P PoE managed switch that was shown in Computex 2019 by QNAP® Systems, Inc. (QNAP) is the world’s first Smart Edge Switch with support for QTS and virtualization to provide network management, data storage, and computing capabilities. The QGD-1600P provides up to 60 watts per port in compliance with the new IEEE 802.3bt […]

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Apacer is the first to release a full range of DDR4-3200 industrial grade memory

Taipei, Taiwan, October 8, 2019 – Aiming at the growing trend of server and IPC high-speed applications, Apacer is the first to introduce a full range of DDR4-3200 servers and industrial-grade DRAM modules to fully support these latest Intel Cascade Lake and AMD “Rome” high-end server processor platforms. Due to the high demand for data processing […]

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HP Reinvents Printing for Today’s Smart Workstyles with the World’s First Laser Tank

MANILA, Philippines, September 27, 2019 – HP today revealed a breakthrough in seamless, low-cost efficiency printing with the launch of the HP Neverstop Laser, which includes a groundbreaking toner reload kit that enables businesses to get back to printing in seconds with no stress, no mess. HP also announced new additions to its print portfolio; […]

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AMD EPYC: Performance Milestones and now, 100 World Records

ROME — September 18, 2019 — At the European launch in Rome, Italy AMD (NASDAQ: AMD) highlighted the growing adoption of 2nd Gen AMD EPYC™ processors across cloud, enterprise and HPC customers. Dell Technologies announced five new Dell EMC PowerEdge platforms powered by the 2nd Gen AMD EPYC processor. These platforms were designed from the […]

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Big Data: The Key to Innovation and Transformation in Banking

Information solutions provider TransUnion Philippines’ recent Big Data Summit tackled the rising power of big data in banking and its potential to transform businesses and manage the emerging difficulties brought about by technology. In particular, it emphasized big data’s capability to innovatively disrupt the industry and fuel its future. Banks and other financial institutions have […]

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Transcend Releases USD230I Series Industrial-Grade Wide Temperature SLC NAND Flash Memory Cards

Transcend is bringing in their USD230I Series industrial-grade wide temperature memory cards in the market. These SLC NAND Flash memory cards are suited for devices that require extensive read/write under harsh environmental conditions, the cards not only operate effectively from -40°C to 85°C but also are built in with ECC and S.M.A.R.T. functions to ensure […]

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Transcend Recommends Corner Bond and Underfill to Increase Reliability for its Embedded Products

Embedded systems are marked by a need for small components, unmatched reliability, and the ability to withstand harsh conditions. Transcend Information, Inc., a leading manufacturer of industrial-grade products, offers corner bond and underfill as customization options for its embedded products to increase reliability under high thermal or vibratory stress, high gravitational acceleration, and high fatigue […]